2904D DATASHEET PDF

The NJM consists of two independent, high gain,. Operation from split. Application areas include transducer amplifiers, DC gain. For example, the NJM can be directly operated off of the.

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Wide Range of Supply Voltages:. LM and LMQ. Low Supply-Current Drain Independent of. Supply Voltage. Low Input Bias and Offset Parameters:. Input Offset Voltage. A Versions. Differential Input Voltage Range Equal to. Maximum-Rated Supply Voltage. Open-Loop Differential Voltage. Internal Frequency Compensation. LM, LMA. These devices consist of two independent, high-gain, frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages.

The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. The LMQ is manufactured to demanding automotive requirements.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On all other products, production processing does not necessarily include testing of all parameters. I O max. PDIP P. SOIC D. Tape and reel. SOP PS. Supply voltage, V C C see Note 1. Differential input voltage, V I D see Note 2. Input voltage, V I either input. Operating virtual junction temperature, T J.

PS package. PW package. FK package. JG package. Operating free-air temperature range, T A. LM, LMQ. Case temperature for 60 seconds.

Storage temperature range, T s t g. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages and V C C specified for measurement of I O S , are with respect to the network ground terminal. Short circuits from outputs to V C C can cause excessive heating and eventual destruction. The package thermal impedance is calculated in accordance with JESD Input offset voltage. Full range. Average temperature coefficient of input offset voltage.

Input offset current. Average temperature coefficient of input offset current. Input bias current. Crosstalk attenuation. Output current. No load. Supply current. Common-mode input voltage range. High-level output voltage. Low-level output voltage. Large-signal differential. Common-mode rejection ratio. Short-circuit output current. Supply current two amplifiers. Short-circuit output. Supply current two. Slew rate at unity gain. Unity-gain bandwidth. Equivalent input noise voltage.

Figure 2. Noise-Test Circuit. Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.

Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components.

To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third—party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.

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TI is not responsible or liable for any such statements. Mailing Address:. This datasheet has been download from:. Datasheets for electronics components.

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